What are critical 3D machine vision system performance criteria

3. What are critical 3D machine vision system performance criteria? [Patrick] Repeatability, reproducibility, throughput/speed across all applications.? Some applications demand very high levels of sensitivity and accuracy. [Frank] Height resolution at 10% per gray value. [Stacy/Glen] Throughput, low false fails, high call accuracy and repeatability are typically performance criteria consider when comparing machine vision systems. [Shavi]

-?Speed of inspection - better than the automatic line tact time

-?Accuracy of results? (in PCB assemble Gage R&R better than 10% on smallest deposits)?

-?Fast set up time?

-?Support all PCB materials and finishes?

-?Less expensive than previous generation?

-?Connection of measurements to process control SW ( real time SPC)?

4. What changes have been taking place in the technologies that are the basis of 3D machine vision systems used in the electronic industry that has resulted in improved performance? [Frank] For triangulation applications partly improved resolution by enhanced laser optics.?

Faster data acquisition by specially designed ASICs, e.g. for triangulation evaluation directly on the camera chip. Advantages for stereoscopic approaches using megapixel camera chips (increased resolution at given overlap). Faster calculators/processors allow for more complicated 3d data evaluations

(Advantages for phase shifting approaches, real-time suppression/correction of artifacts etc.)

[Shavi] New sensors (large foot print ?higher resolution) and ability to control the data extraction algorithms. [Stacy/Glen] The evolution of solid shape modeling (SSM) to provide a full 3D view of components and solder paste deposits has taken the 3D machine vision concept for AOI to a new level.? This technology gives users the ability to maintain higher call accuracy and additionally gives users rotatable views of images that can assist them with process understanding.? Improved imaging technologies and the continuing improvement in price/performance of computers increase system performance while reducing system cost. [Patrick] Shadow moir?algorithms are getting smarter and more robust? - readily increasing the range of surfaces that can be analyzed with the technique.? Also, we are seeing better off-the-shelf image processing tools that help our analyses operate faster and more robustly. Image processing tools (such as part finder algorithms) represent good opportunities to increase performance at reduced cost.? For example, less accuracy is needed for part delivery into the inspection head to achieve the same quality level of measurement .??

5. Where do you see breakthroughs coming in the technologies that are the basis of 3D machine vision systems used in the electronic industry that will result in further improvements in the near future - next three years? [Stacy/Glen] Camera technologies and computer performance continue to advance and thus allow speeds and throughputs PCB Assembly to be positively impacted.? The evolution of software solutions such as Agilent's solid shape modeling (SSM) also provides users with more information to make improvements and facilitate understanding about their process, products, etc. The evolution of these two areas will drive 3D imaging. [Shavi] Better sensors (faster) that will allow further improvement in speed and larger sensor dimension that will allow larger FOV or longer line scanning. [Frank] Perhaps more intensive use of 3D-ASICs with faster performance [Patrick] Cost, processing speed and multifunctional systems (bundled capabilities) are always of interest to our customer抯 future needs.? We are only adopting/developing techniques that can move from the laboratory to the production floor.?

6. Are there market changes in the electronic industry that are driving the adoption of 3D machine vision? [Frank] Smaller structures (0201, pitch 0.3mm) needs test gates behind every production step due to higher possibility of faults. [Stacy/Glen] There are two main drivers for these changes and their adoption in the industry.? One category is quality and the other is technology.? The interest in quality is increasing as companies compete for assembly contracts, quality can be linked to 3D information in many cases with inspection and as such, 3D imaging is critical.? With regards to technology, smaller pitches, increased circuit density and speeds, advances in component technologies and the emergence of lead-free are impacting interested in 3D machine vision. [Patrick] In our business, yes.? There are definite issues with warpage for fine pitch devices that are on the leading edge of assembly technologies.? Larger BGA devices (40mm +), Lead-free processing techniques, bromine-free laminates materials, expanded options of underfill and encapsulants products ?all require characterization for impact on warpage.? Warpage can heighten defects dramatically on fine pitch assemblies. [Shavi] Yes - finer components and finer pitches of paste deposits require 3D view on them because the volume of the deposits is the main indicator of the level of good soldering. In addition it is also height. Imagine a BGA where not all deposits are the same height - not all balls will be soldered correctly.

7. How will 3D machine vision systems have to change to meet emerging applications in the electronic industry? [Patrick] Depends on the application.? But for our business we will seek to add additional functionality to our systems and/or incorporate our technology into existing/other inspection systems. [Shavi] 1) meet line speed 2) less expensive, 3) able to detect small deposits. [Stacy/Glen] Continuous evolution of speed and call accuracy, always with an eye toward cost, are typically required to meet the needs of emerging applications.?? [Frank] Perhaps more intuitive system operation.

8. As a supplier of 3D machine vision systems for the electronic industry what are some challenges you face in marketing such systems? [Frank] The market misunderstanding of what 3D really means.? Staying on the price performance curve. [Patrrick] As an emerging company, we are faced with a wide range of issues including: Distribution channels (i.e. indirect sales force); on-site demonstration systems; paradigm shift (i.e. new approach versus old approach) required for inspection mentality in some application areas. [Shavi] 1) Pass the accuracy test at each customer in order to meet requirements. 2) Education of market on the importance of 3D versus 2D systems. [Stacy/Glen] Customers' assembly lines continue to run faster and faster, and competition among suppliers of imaging equipment are driving the industry to design and build faster, more reliable, and less costly systems.

9. What are your thoughts on the future of 3D machine vision in the electronic industry? [Stacy/Glen] 3D electronic assembly techniques have the potential to offer a quantum leap in performance levels from advanced test and measurement equipment, particularly as densities increase, double sided boards become the norm, and end customers' reliability expectations continue to rise.? The powerful advantages of 3D techniques mean they are rapidly becoming the only safe bet for future test and inspection. [Patrick] We feel the future is very positive.? And not just in the electronics industry.? We are looking aggressively at other markets/industries that will benefit from our existing technologies and optical/non-contact metrology tools as a whole. [Shavi] There are a lot of segments that will require 3D inspection - Ball inspection, memory cards and also some semiconductor applications. [Frank] The importance of 3D inspection will increase for a certain (but as well limited) range of applications.? 3D will NOT replace 2D-solutions for all applications!

10. What advice would you give to a company investigating the purchase of a 3D machine vision system for an electronic industry application? [Shavi] 1) Check that the AOI machine is really meeting your specification of inspection: speed, setup time and accuracy. In addition a full solution is required to improve the process and additional SW tools should be available to make process improvements. [Frank] Analyze why you want 3D and the benefits that it brings your company before you review the possible solutions. [Patrick] Don't buy more than you need. We see numerous customers with a performance list (and/or wish list) that is far in excess of their primary applications. All this excess can greatly impact your price, cost of ownership and the ROI. Of course, one must think of future application needs, but see if the platform is upgradeable to accommodate future improvements that will cost less at a later date.

[Stacy/Glen] Considering a portfolio solution can improve the cost of ownership for the customer.? Be sure to include the cost of ownership and system flexibility in your considerations. These often impact the bottom line more than feature-based investigation of machine vision solutions.?? Also, a realistic analysis of the cost of passing along defects instead of finding and fixing them as early as possible will demonstrate the economics of 3D inspection.